SMT DIP FPC assemble

FPC Capabilities
Layers:
Flexible Printed Circuit(FPC) Board: 1-8 layers
Rigid-Flex Board：2-8 layers
Base Material: Polyimide(PI), Polyester(PET)
Production Capability:
Single-sided：30,000M²/Month
Double-sided/Multi-layers:20,000M²/Month
Max Size: 500*1200mm
Thickness: 0.05mm-0.75mm
Copper Thickness: 12um(1/3OZ),18um(1/2OZ),35um(1OZ),70um(2oz),
6um(1/4OZ), 140um (4OZ)
Min line width/spacing: ± 0.05mm
Stiffener Material type: PI ,FR4 ,PET ,Steel piece
Etching Tolerance: ± 0.02mm
Min Hole Diameter 0.1mm
Hole Tolerance: PTH: +/- 0.05mm
NPTH: +/-0.03mm
Outline: Punching, Laser cut
Solder mask color: Yellow , Black, White
Silkscreen color: Black,White
Surface treatment: OSP, ENIG,Immersion Tin,Immersion silver, Gold plating
FPC Lead time: Samples 1-3 days , Bulk orders 7-10 days,
Special requirements 10-15 days
Assembly Capabilities
Mixed Technologies
Assembly:
SMT reflow and/or wave soldering,Automated mounting of
SMD components
DIP(Through-hole assembly),Through-Hole devices (PTH)
wave or hand soldering
COB (Automated Solder COB components)
BGA(Ball Grid Arrays)Micro-BGA,High Density
Interconnections (HDI)
Conformal Coating & Potting
Complete Electronic or Mechanical Assembly or Box
Builds
Test Solutions:
AOI (Automated Optical Inspection)
ICT (In-Circuit Test )
IC Programming
Analogue & digital functional test
BGA X-Ray Evaluation
FCT Functional Testing
PCBA lead time: Samples 1-2 weeks, Bulk orders 3-4 weeks