One stop PCB,PCBA and finished product manufacturer

One stop PCB,PCBA and finished product manufacturer

FPC Capabilities


Layers:
Flexible Printed Circuit(FPC) Board: 1-8 layers
Rigid-Flex Board:2-8 layers
Base Material:Polyimide(PI), Polyester(PET)

Production Capability:
Single-sided:30,000M²/Month
Double-sided/Multi-layers:20,000M²/Month
Max Size:500*1200mm
Thickness:0.05mm-0.75mm
Copper Thickness:12um(1/3OZ),18um(1/2OZ),35um(1OZ),70um(2oz), 6um(1/4OZ), 140um (4OZ)
Min line width/spacing:± 0.05mm
Stiffener Material type:PI ,FR4 ,PET ,Steel piece
Etching Tolerance:± 0.02mm
Min Hole Diameter0.1mm

Hole Tolerance:
PTH: +/- 0.05mm
NPTH: +/-0.03mm
Outline:Punching, Laser cut
Solder mask color:Yellow , Black, White
Silkscreen color:Black,White
Surface treatment:OSP, ENIG,Immersion Tin,Immersion silver, Gold plating
FPC Lead time:Samples 1-3 days , Bulk orders 7-10 days,         Special requirements 10-15 days

Assembly  Capabilities







Mixed Technologies Assembly:
SMT reflow and/or wave soldering,Automated mounting of SMD components
DIP(Through-hole assembly),Through-Hole devices (PTH) wave or hand soldering
COB (Automated Solder COB components)
BGA(Ball Grid Arrays)Micro-BGA,High Density Interconnections (HDI)
Conformal Coating & Potting
Complete Electronic or Mechanical Assembly or Box Builds





Test Solutions:
AOI (Automated Optical Inspection)
ICT (In-Circuit Test )
IC Programming
Analogue & digital functional test
BGA X-Ray Evaluation
FCT Functional Testing
PCBA lead time:Samples 1-2 weeks, Bulk orders 3-4 weeks

PCB  Capabilities

Layers: 1-40 layers
Copper Thickness: 0.5-10 OZ
Material: FR4(Shengyi of China,ITEQ,KB,High TG) PTFE,Rogers,Arlon,Taconic,Aluminum base,Ceramic etc
Solder Mask Color: Green, Yellow, White, Blue, Black, Red
Silkscreen Color: White,Black,Yellow
Surface Treatment: OSP,HASL,Lead Free HASL,ENIG,Immersion Silver,      Carbon ink,Gold Plating
Products Type:  High thermal conductivity, High-Frequency,      Millimeter-Wave Radar, Impedance control board,        HDI board,Cross blind buried hole, BGA,             Mixing materials FR4+Rogers
Min hole size: Mechanical hole: 0.15mm
Laser hole: 0.1mm
Min line width/spacing: 0.075mm
Min welding ring: 4 mil
Min solder mask bridge: ≥0.08mm

Hole Tolerance:
PTH: +/-3mil
NPTH: +/-2mil
Outline: Rout,V-cut,Bridge,Stamp hole
E-Test: Flying probe testing ,Tools test
PCB Lead time: Samples 1-3 days, bulk orders 7-10 days

Assembly  Capabilities







Mixed Technologies Assembly:
SMT reflow and/or wave soldering,Automated mounting of SMD components
DIP(Through-hole assembly),Through-Hole devices (PTH) wave or hand soldering
COB (Automated Solder COB components)
BGA(Ball Grid Arrays)Micro-BGA,High Density Interconnections (HDI)
Conformal Coating & Potting
Complete Electronic or Mechanical Assembly or Box Builds






Test Solutions:
AOI (Automated Optical Inspection)
ICT (In-Circuit Test )
IC Programming
Analogue & digital functional test
BGA X-Ray Evaluation
FCT Functional Testing
PCBA lead time: Samples 1-2 weeks, Bulk orders 3-4 weeks

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