Heater flex FPC

PCB Capabilities
Layers: 1-40 layers
Copper Thickness: 0.5-10 OZ
Material: FR4(Shengyi of China,ITEQ,KB,High TG)
PTFE,Rogers,Arlon,Taconic,Aluminum base,Ceramic etc
Solder Mask Color: Green, Yellow, White, Blue, Black, Red
Silkscreen Color: White,Black,Yellow
Surface Treatment: OSP,HASL,Lead Free HASL,ENIG,Immersion Silver,
Carbon ink,Gold Plating
Products Type:
High thermal conductivity, High-Frequency,
Millimeter-Wave Radar, Impedance control board,
HDI board,Cross blind buried hole, BGA,
Mixing materials FR4+Rogers
Min hole size: Mechanical hole: 0.15mm
Laser hole: 0.1mm
Min line width/spacing: 0.075mm
Min welding ring: 4 mil
Min solder mask bridge: ≥0.08mm
Hole Tolerance: PTH: +/-3mil
NPTH: +/-2mil
Outline: Rout,V-cut,Bridge,Stamp hole
E-Test: Flying probe testing ,Tools test
PCB Lead time: Samples 1-3 days, bulk orders 7-10 days
Assembly Capabilities
Mixed Technologies
Assembly:
SMT reflow and/or wave soldering,Automated mounting of
SMD components
DIP(Through-hole assembly),Through-Hole devices (PTH)
wave or hand soldering
COB (Automated Solder COB components)
BGA(Ball Grid Arrays)Micro-BGA,High Density
Interconnections (HDI)
Conformal Coating & Potting
Complete Electronic or Mechanical Assembly or Box Builds
Test Solutions:
AOI (Automated Optical Inspection)
ICT (In-Circuit Test )
IC Programming
Analogue & digital functional test
BGA X-Ray Evaluation
FCT Functional Testing
PCBA lead time: Samples 1-2 weeks, Bulk orders 3-4 weeks