FPC Capabilities | |
Layers: | Flexible Printed Circuit(FPC) Board: 1-8 layers |
| Rigid-Flex Board：2-8 layers | |
| Base Material: | Polyimide(PI), Polyester(PET) |
Production Capability: | Single-sided：30,000M²/Month |
| Double-sided/Multi-layers:20,000M²/Month | |
| Max Size: | 500*1200mm |
| Thickness: | 0.05mm-0.75mm |
| Copper Thickness: | 12um(1/3OZ),18um(1/2OZ),35um(1OZ),70um(2oz), 6um(1/4OZ), 140um (4OZ) |
| Min line width/spacing: | ± 0.05mm |
| Stiffener Material type: | PI ,FR4 ,PET ,Steel piece |
| Etching Tolerance: | ± 0.02mm |
| Min Hole Diameter | 0.1mm |
Hole Tolerance: | PTH: +/- 0.05mm |
| NPTH: +/-0.03mm | |
| Outline: | Punching, Laser cut |
| Solder mask color: | Yellow , Black, White |
| Silkscreen color: | Black,White |
| Surface treatment: | OSP, ENIG,Immersion Tin,Immersion silver, Gold plating |
| FPC Lead time: | Samples 1-3 days , Bulk orders 7-10 days, Special requirements 10-15 days |
Assembly Capabilities | |
Mixed Technologies Assembly: | SMT reflow and/or wave soldering,Automated mounting of SMD components |
| DIP(Through-hole assembly),Through-Hole devices (PTH) wave or hand soldering | |
| COB (Automated Solder COB components) | |
| BGA(Ball Grid Arrays)Micro-BGA,High Density Interconnections (HDI) | |
| Conformal Coating & Potting | |
| Complete Electronic or Mechanical Assembly or Box Builds | |
Test Solutions: | AOI (Automated Optical Inspection) |
| ICT (In-Circuit Test ) | |
| IC Programming | |
| Analogue & digital functional test | |
| BGA X-Ray Evaluation | |
| FCT Functional Testing | |
| PCBA lead time: | Samples 1-2 weeks, Bulk orders 3-4 weeks |
PCB Capabilities | |
| Layers: | 1-40 layers |
| Copper Thickness: | 0.5-10 OZ |
| Material: | FR4(Shengyi of China,ITEQ,KB,High TG) PTFE,Rogers,Arlon,Taconic,Aluminum base,Ceramic etc |
| Solder Mask Color: | Green, Yellow, White, Blue, Black, Red |
| Silkscreen Color: | White,Black,Yellow |
| Surface Treatment: | OSP,HASL,Lead Free HASL,ENIG,Immersion Silver, Carbon ink,Gold Plating |
| Products Type: | High thermal conductivity, High-Frequency, Millimeter-Wave Radar, Impedance control board, HDI board,Cross blind buried hole, BGA, Mixing materials FR4+Rogers |
| Min hole size: | Mechanical hole: 0.15mm |
| Laser hole: 0.1mm | |
| Min line width/spacing: | 0.075mm |
| Min welding ring: | 4 mil |
| Min solder mask bridge: | ≥0.08mm |
Hole Tolerance: | PTH: +/-3mil |
| NPTH: +/-2mil | |
| Outline: | Rout,V-cut,Bridge,Stamp hole |
| E-Test: | Flying probe testing ,Tools test |
| PCB Lead time: | Samples 1-3 days, bulk orders 7-10 days |
Assembly Capabilities | |
Mixed Technologies Assembly: | SMT reflow and/or wave soldering,Automated mounting of SMD components |
| DIP(Through-hole assembly),Through-Hole devices (PTH) wave or hand soldering | |
| COB (Automated Solder COB components) | |
| BGA(Ball Grid Arrays)Micro-BGA,High Density Interconnections (HDI) | |
| Conformal Coating & Potting | |
| Complete Electronic or Mechanical Assembly or Box Builds | |
Test Solutions: | AOI (Automated Optical Inspection) |
| ICT (In-Circuit Test ) | |
| IC Programming | |
| Analogue & digital functional test | |
| BGA X-Ray Evaluation | |
| FCT Functional Testing | |
| PCBA lead time: | Samples 1-2 weeks, Bulk orders 3-4 weeks |
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