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Home >> Manufacturing & Technical >> MCPCB Capabilities |
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NO. |
ITEM |
INDEX |
01 |
Surface treatment |
HAL(lead free), Immersion Gold, OSP |
02 |
Layer |
Single-sided, double-sided, multilayer and special structure layer |
03 |
Max size |
1200mm*600mm |
04 |
PCB thickness |
0.5-3.3mm |
05 |
Copper foil thickness |
H 1 2 3 4 5 6 10(OZ) |
06 |
Insulating layer thickness |
50 75 100 125 150 micron |
07 |
Metal base type |
Aluminum,Ferrum,Copper,Stainless steel |
08 |
Metal base thickness |
0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2 (mm) |
09 |
Shaping |
Die Punching, CNC Route, CNC V-Cut |
10 |
Testing |
100% Compute Short/Open Circuit Test |
11 |
The Minimum Hole Diameter |
single-sided 0.8mm, PTH 0.3mm |
12 |
The Minimum Pad Size |
1.2mm |
13 |
The Minimum PTH Distance |
2.0mm |
14 |
The Minimum Line Width |
0.1mm |
15 |
The Minimum Increase of Solder Mask |
0.15mm |
16 |
The Minimum Pad |
10um |
17 |
Solder Mask Color |
green, white, black, red, yellow |
18 |
The Minimum Letter Width |
0.15mm |
19 |
The Minimum Letter Height |
0.8mm |
20 |
Letter Color |
white, black, blue, yellow, red | | |
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