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NO.

ITEM

INDEX

01

Surface treatment

HAL(lead free), Immersion Gold, OSP

02

Layer

Single-sided, double-sided, multilayer and special structure layer

03

Max size

1200mm*600mm

04

PCB thickness

0.5-3.3mm

05

Copper foil thickness

H 1 2 3 4 5 6 10(OZ)

06

Insulating layer thickness

50 75 100 125 150 micron

07

Metal base type

AluminumFerrumCopperStainless steel

08

Metal base thickness

0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2 (mm)

09

Shaping

Die Punching, CNC Route, CNC V-Cut

10

Testing

100% Compute Short/Open Circuit Test

11

The Minimum Hole Diameter

single-sided 0.8mm, PTH 0.3mm

12

The Minimum Pad Size

1.2mm

13

The Minimum PTH Distance

2.0mm

14

The Minimum Line Width

0.1mm

15

The Minimum Increase of Solder Mask

0.15mm

16

The Minimum Pad

10um

17

Solder Mask Color

green, white, black, red, yellow

18

The Minimum Letter Width

0.15mm

19

The Minimum Letter Height

0.8mm

20

Letter Color

white, black, blue, yellow, red

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